Sputtering

Service description

It includes deposition both by thermal evaporation and ion-beam-sputtering, and it is possible to combine both methods in the same multilayer. The evaporation systems contain filaments and boat-type thermal evaporation sources. Ion beam sputtering deposition uses a hollow cathode, 3-cm diameter ion gun and a cooled target holder system. Some of the systems are located in clean rooms. -Coating deposition in ISO-6 clean room. The equipment has a 75-cm diameter, 100-cm tall cylindrical chamber that is located in an ISO-6 clean room. It includes deposition by both evaporation and sputtering, and it enables combining both techniques in the same multilayer. The target holder for sputtering hosts 130-mm diameter targets. The system allows coating deposition by evaporation of up to 3 different materials and by sputtering of up to 4 different materials. The equipment has a sample heating system up to approximately 400ºC. The sample holder can accommodate substrates up to 150 mm in diameter and can rotate to improve coating uniformity. The system is evacuated with a cryogenic pump. - Deposition in chambers connected to far-extreme ultraviolet reflectometer. The equipment has evaporation and sputtering deposition systems connected to a far and extreme ultraviolet reflectometer in order to measure the reflectance and transmittance of the coatings in situ, i.e., before exposing them to the atmosphere. The evaporation and sputtering systems are located in two ultra-high vacuum chambers, both connected in vacuum to each other and to the reflectometer. All these systems are located in an ISO-8 clean room. The system also allows coating deposition with an electron beam. The target holder for sputtering hosts 100-mm diameter targets. The system allows coating deposition by evaporation of up to 3 different materials and by sputtering of up to 4 different materials. The evaporation equipment has a sample heater of up to approximately 300ºC. The sample holder can accommodate substrates up to 50.8 mmx50.8 mm and 3-mm thick. The evaporation chamber is evacuated with an ion and a titanium sublimation pump. The sputtering chamber is evacuated with a cryogenic pump.