PIF2025 - Microelectronic integrated vision components for extended reality (XR) devices - (PID2024-155219OB-C31)

This predoctoral contract is part of the EXTREME project, which focuses on developing microelectronic components for vision systems integrated into extended reality (XR) devices—virtual, augmented, and mixed reality. The overall objective is to advance technologies that enable the efficient capture and processing of visual information in real time, under strict power consumption and size constraints. The possible research lines include: high dynamic range (HDR) image sensors and auto-exposure techniques, sensor-embedded analog-to-digital (ADC) and time-to-digital (TDC) converters, the implementation of compressive sensing and sparse representations at the sensor plane, and advanced sensor integration using 3D technologies, flip-chip, and chiplets for heterogeneous systems. The thesis topic will be completely defined with the candidate, whose profile need to be strong on analog and mixed-signal integrated circuit design and advanced integration. The work will be carried out in a highly collaborative environment, with access to circuit design and characterization infrastructure, and the possibility of international research stays.