PIF2025 - Design and development of compact, robust and smart switching cells based on chip-embedding - (PID2024-160767OB-I00)

Power electronics is a key enabler of the energy transition, supporting renewable electrification across an increasing range of applications. Power electronic circuits rely on switching cells (SCs) that integrate semiconductor devices and control components. There is growing demand for smarter, more compact, and efficient SCs to enhance power density and reliability. Current SCs typically use traditional packaging solutions based on discrete devices or multi-chip modules, along with interconnection and thermal management systems. However, conventional wire-bonding introduces parasitic inductances, which limit the performance of wide bandgap (WBG) devices such as SiC and GaN. Advanced packaging technologies address these limitations, notably chip-embedding (CE), which integrates bare dies into multilayer PCBs. CE reduces parasitics, improves efficiency, lowers costs, and allows control circuits to be placed on the top layer while embedding power stages within the PCB. The Spanish project POWERCELLS aims to develop advanced, compact, and intelligent switching cells using novel chip-embedding processes and specialized power devices developed or adapted at the IMB-CNM clean room. The proposed PhD research focuses on the design, fabrication, and characterization of these switching cells, addressing the main technological and scientific challenges involved in such developments.