MULTIFILAMENT THERMAL SOURCE FOR AN EFFICIENT DEPOSITION OF THIN LAYERS BY PHYSICAL VAPOR DEPOSITION (PVD)

CSIC has developed a resistive thermal source suitable for thin layer deposition by Physical Vapor Deposition. Deposition can be optimized with the new sources since they admit more than twice the evaporant mass compared with conventional sources consisting in helical filaments of the same length and at the same electric power. This new source has a simple geometry which makes fabrication easier and lowers its costs      
Industrial partners manufacturers of lab equipment are being sought to collaborate through a patent license agreement.