Wafer cutting and chip dicing

Support unit: Encapsulado de chips
Institute: INSTITUTO DE MICROELECTRONICA DE BARCELONA
Locality: Cerdanyola del Vallès (Barcelona)
Service's web: http://www.imb-cnm.csic.es

Information relating to the units that offer the selected service
Support unit	Support unit Information	Selected service	Other services
Encapsulado de chips IMB-CNM - Cerdanyola del Vallès

Silicon wafer cutting and individual chip separation (dicing) by means of DISCO circular saw.

Options and prices chart
Options	Unit	Public Sector	Other customers
GENERAL	€ / hora	115.04 €	161.06 €
GENERAL	€ / hora	152.89 €	214.04 €