Packaging-Assembly: Wire bonding ball

Support unit: Encapsulado de chips
Institute: INSTITUTO DE MICROELECTRONICA DE BARCELONA
Locality: Cerdanyola del Vallès (Barcelona)
Service's web: http://www.imb-cnm.csic.es

Information relating to the units that offer the selected service
Support unit	Support unit Information	Selected service	Other services
Encapsulado de chips IMB-CNM - Cerdanyola del Vallès

Machine for connecting metallic wires in surface electrodes

Options and prices chart
Options	Unit	Public Sector	Other customers
General	€ / h	115.04 €	161.06 €